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Copper electroplating method and apparatus
Plating apparatus and method: 6391188, Apr 07 1999: Shipley Company, L.L.C. Processes and apparatus for recovery and removal of copper from fluids: 6395152, Jul 09 1998: ACM Research, Inc. Methods and apparatus for electropolishing metal interconnections on semiconductor devices: 6402923, Mar 27 2000: Novellus Systems, Inc
learn moreUS3894675A - Method and apparatus for making copper clad ...
Copper clad steel wire is continuously produced by forming a copper sheet into a tube around the wire and welding the copper tube, at the edges, to produce a longitudinal seam. The diameter of the welded copper tube is reduced to the diameter of the wire, and the composite heated to a temperature of at least 850*C, at which temperature the cross sectional area of the composite wire is reduced ...
learn moreUS6162301A - Methods and apparatus for cleaning ...
A cleaning solution, method, and apparatus for cleaning semiconductor substrates after chemical mechanical polishing of copper films is described. The present invention includes a cleaning solution which combines deionized water, an organic compound, and a fluoride compound in an acidic pH environment for cleaning the surface of a semiconductor substrate after polishing a copper layer.
learn moreCopper Purification Process - Electrolytic Copper Refining ...
Electrolytic refining of impure copper is the best available copper purification method in the world. After purified using electrolysis, 99.99% pure copper is refined to be used as cables, brasses etc.
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Method for electroplating a metal onto a flat substrate P. Surfaces are electrically polarized for metal deposition by feeding thereto at least one first and second forward-reverse pulse current sequences. The first forward-reverse pulse current sequence includes a first forward pulse generating a first cathodic current during a first forward pulse duration tf1 and having a first forward pulse ...
learn moreA convenient example of an electrogravimetric method of ...
complete, turn off the electrolysis apparatus (Note 3), disconnect the electrodes, and dip them in acetone. Dry the cathode for about 3 min at 110°C. Allow the electrode to cool in air, and then weigh it. Report the percentage of copper in the alloy. %% = × sample Cu m m Cu Notes 1.
learn moreCorrosion Issues & Test Methods
• Test Method: 90 g lube + 10 g water + 1 g alumina, reflux 48 hours. Extract with 90 g more water. Passing result is <20 ppm formate/acetate. • Alternate procedure is ASTM D2619. • However, even copper tubing "as supplied" shows significant interior & exterior pitting
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My article on Young's Modulus by Searle's Method appeared on top of Google Search. I extended it further to make it more useful. This comprehensive articles covers theoretical principles, worked out examples, IIT JEE solved problems, exercises (more than 35), and links to related articles/videos. You will get everything you need on Searle's method. I am sure you will like this article even ...
learn moreA convenient example of an electrogravimetric method of ...
complete, turn off the electrolysis apparatus (Note 3), disconnect the electrodes, and dip them in acetone. Dry the cathode for about 3 min at 110°C. Allow the electrode to cool in air, and then weigh it. Report the percentage of copper in the alloy. %% = × sample Cu m m Cu Notes 1.
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Zhengtai Machinery Factory - How to Start a . The process of making bricks generally consists of the following steps: Gathering, crushing, grinding, screening, and mixing the raw materials producing the brick The setting, drying, firing Packaging and inventorying is the final processing in the manufacture of bricks Before you start manufacturing consider completing a business course.
learn moreCopper interconnect wiring and method and apparatus for ...
capping layer or layers on a surface of a copper interconnect wiring layer for use in interconnect structures for integrated circuits and methods and apparatus for forming improved integration interconnection structures for integrated circuits by the application of gas-cluster ion-beam processing. Reduced copper diffusion and improved electromigration lifetime result and the use of selective ...
learn moreMethod and apparatus for plating substrate with copper ...
Oct 28, 2003· BACKGROUND OF THE INVENTION. 1. Field of the Invention. The present invention relates to a method and apparatus for separating out metal copper according to an electroplating of copper using, for example, a solution of copper sulfate in order to fill copper in fine interconnection grooves formed in a surface of a substrate such as a semiconductor wafer to produce copper .
learn moreEPA Method 200.8: Determination of Trace Elements in ...
METHOD 200.8. DETERMINATION OF TRACE ELEMENTS IN WATERS AND WASTES BY INDUCTIVELY COUPLED PLASMA - MASS SPECTROMETRY ... Copper (Cu) 7440-50-8 Lead (Pb) 7439-92-1 Manganese (Mn) 7439-96-5 ... are present in the laboratory environment, reagents, or apparatus (Sections 7.6.2 and 9.3.1). 3.11 Linear Dynamic Range (LDR) - The concentration range ...
learn moreElectroplating: Copper-Plated Key - Home Science Tools
The copper sulfate solution is an electrolyte that conducts electricity from one electrode to the other, creating an electrical current. When the current is flowing, oxidation (loss of electrons) happens at the copper anode, adding copper ions to the solution.
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Barrier metal film production apparatus, barrier metal film production method, metal film production method, and metal film production apparatus US6872657B2 (en) * 2003-08-08: 2005-03-29: Agency For Science, Technology And Research: Method to form copper seed layer for copper interconnect
learn moreExtracting metals with charcoal | Resource | RSC Education
Class practical. In each of the two experiments, illustrating the idea of competition between metals and carbon, students heat a metal oxide with powdered charcoal.If the carbon is more reactive than the metal it will remove the oxygen from the metal oxide and leave traces of the metal in the reaction vessel.The first experiment uses lead(II) oxide; the second modifies the technique slightly ...
learn moreMETHOD AND APPARATUS FOR MINING COPPER - Ehsani .
Oct 24, 2019· METHOD AND APPARATUS FOR MINING COPPER . United States Patent Application 20190323633 . Kind Code: A1 . Abstract: Mining methods and systems are disclosed for In-Situ Leaching (ISL) of the mineral ores. ISL extraction is conducted by injecting a suitable leach solution into the ore zone below the water table; oxidizing, complexing and ...
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Methods Requirements for approving methods using the expedited process October 12, 2018 - EPA announces approval of alternative testing methods (PDF) (17 pp, 362 K, About PDF )
learn moreMethod and apparatus for electrolytic refining of copper ...
Jan 02, 1990· The invention relates to a method and apparatus for electrolytic refining of copper and the production of copper wires for electrical purposes on a continual basis which produces round copper wires directly from impure copper anodes and to treat such wires in order to impart the desired characteristics as electrical conductors.
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TWA 1 mg/m 3 [*Note: The PEL also applies to other copper compounds (as Cu) except copper fume.] Measurement Methods NIOSH 7029, 7300, 7301, 7303, 9102 ;
learn moreHow to Make Copper Sulfate - ThoughtCo
May 03, 2019· Copper sulfate crystals are among the most beautiful crystals you can grow, but you might not have access to a chemistry lab or want to order the copper sulfate from a chemical supply company. That's okay because you can make copper sulfate yourself using readily-available materials.
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copper method anode Prior art date 2000-05-10 Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.) Active, expires 2021-06-21 Application number US10/318,497 Inventor Steven T. Mayer Evan E. Patton Robert L ...
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Methods Session 1 – Building a Robust Dissolution ... needed then Apparatus 3 and 4 are often considered after exhausting Paddle and Basket testing For Transdermals Apparatus 5-7 are the primary choices . What does a proper method exhibit? •Low variability .
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